Microelectronics

Microelectronics, 2nd Edition (repost)  eBooks & eLearning

Posted by libr at June 4, 2017
Microelectronics, 2nd Edition (repost)

Microelectronics, 2nd Edition by Jerry C. Whitaker
English | 2006 | ISBN-10: 0849333911 | PDF | 464 pages | 14,4 MB

Microelectronics: Circuit Analysis and Design (4th Edition) (Repost)  eBooks & eLearning

Posted by roxul at Sept. 4, 2016
Microelectronics: Circuit Analysis and Design (4th Edition) (Repost)

Donald Neamen, "Microelectronics: Circuit Analysis and Design (4th Edition)"
English | 2009 | ISBN: 0073380644 | 1395 pages | PDF | 12 MB

Microelectronics, 2nd Edition (repost)  eBooks & eLearning

Posted by interes at July 30, 2014
Microelectronics, 2nd Edition (repost)

Microelectronics, 2nd Edition by Jerry C. Whitaker
English | 2006 | ISBN-10: 0849333911 | PDF | 464 pages | 14,4 MB

When it comes to electronics, demand grows as technology shrinks. From consumer and industrial markets to military and aerospace applications, the call is for more functionality in smaller and smaller devices.

RF and Microwave Microelectronics Packaging II: 2 [Repost]  eBooks & eLearning

Posted by hill0 at Aug. 9, 2017
RF and Microwave Microelectronics Packaging II: 2 [Repost]

RF and Microwave Microelectronics Packaging II: 2 by Ken Kuang
English | 22 Mar. 2017 | ISBN: 3319516965 | 186 Pages | PDF | 6.24 MB

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics.

Handbook of Thick- and Thin-film Hybrid Microelectronics (Repost)  eBooks & eLearning

Posted by nebulae at July 26, 2017
Handbook of Thick- and Thin-film Hybrid Microelectronics (Repost)

Tapan K. Gupta, "Handbook of Thick- and Thin-film Hybrid Microelectronics"
English | ISBN: 0471272299 | 2003 | 424 pages | PDF | 3 MB
3D Microelectronic Packaging: From Fundamentals to Applications (Springer Series in Advanced Microelectronics) [Repost]

3D Microelectronic Packaging: From Fundamentals to Applications (Springer Series in Advanced Microelectronics) by Yan Li
English | 8 Feb. 2017 | ISBN: 3319445847 | 476 Pages | PDF | 20.87 MB

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging,

Power Microelectronics: Device and Process Technologies, Second Edition  eBooks & eLearning

Posted by interes at June 28, 2017
Power Microelectronics: Device and Process Technologies, Second Edition

Power Microelectronics: Device and Process Technologies, Second Edition by Yung Chii Liang and Ganesh S Samudra
English | 2017 | ISBN: 9813200243 | 600 pages | PDF | 18,7 MB

Microelectronics: Circuit Analysis and Design, 4th Edition (Repost)  eBooks & eLearning

Posted by nebulae at June 11, 2017
Microelectronics: Circuit Analysis and Design, 4th Edition (Repost)

Donald Neamen, "Microelectronics: Circuit Analysis and Design, 4th Edition"
English | 2009 | ISBN-10: 0073380644 | PDF | 1395 pages | 110 MB
3D Microelectronic Packaging: From Fundamentals to Applications (Springer Series in Advanced Microelectronics)

3D Microelectronic Packaging: From Fundamentals to Applications (Springer Series in Advanced Microelectronics) by Yan Li
English | 8 Feb. 2017 | ISBN: 3319445847 | 476 Pages | PDF | 20.87 MB

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging

RF and Microwave Microelectronics Packaging II  eBooks & eLearning

Posted by hill0 at March 11, 2017
RF and Microwave Microelectronics Packaging II

RF and Microwave Microelectronics Packaging II: 2 by Ken Kuang
English | 5 Apr. 2017 | ISBN: 3319516965 | 172 Pages | PDF | 6.21 MB

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management,